About Exhibition Adhesion & Bonding Expo 2026 Osaka will be held from 13th - 15th May 2026 at INTEX Osaka in Japan. This is a leading industrial trade fair dedicated to showcasing the latest advancements in adhesive and bonding technologies. It offers a comprehensive platform for professionals and businesses to explore a wide range of products, services, and solutions related to adhesion and bonding. It caters to various industries, including automotive, electronics, construction, and more.